1775842-1
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1775842-1 datasheet
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Маркировка1775842-1
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ПроизводительTE Connectivity
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ОписаниеTE Connectivity 1775842-1 Applies To: Printed Circuit Board Assembly Process Feature: Without Pick and Place Cover Contact Plating, Mating Area, Material: Gold Contact Plating, Mating Area, Thickness (?µm [??in]): 0.1 [3.937] Contact Termination Type: Through Hole Gender: Receptacle Housing Color: Black Industry Standard: USB 2.0 Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Led: Without Locating Post(s): Without Locking Feature: Without Mount Location: Top Number Of Ports: 1 Number Of Positions: 4 Orientation: Flag Packaging Method: Tape & Reel Panel Ground: Without Pcb Mount Retention Type: Kinked Leg(s) Pcb Thickness, Recommended (mm [in]): 1.20 [0.048] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Series: A Shell Plating: Nickel over Copper Size: Standard Tail Length (mm [in]): 2 [0.079] Termination Method: Solder Usb-if Test Id Number (tid): Not Submitted For Testing
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Количество страниц3 шт.
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Форматы файлаHTML, PDF
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